Oct-2014
3D NAND flash memory project was officially launched.
Jun-2015
9-layer 3D NAND test chip passed electrical performance verification.
Jul-2016
The design of 32L 3D NAND test chip was completed.
Jul-2016

Yangtze Memory Technologies Co., Ltd. was established.

Dec-2016

National IC Base Project was kicked off.

Jul-2017

The design of 32L 3D NAND flash was completed.

Sept-2017
The roof of fab 1 was sealed ahead.
Nov-2017
The first silicon of 32L 3D NAND came out. 
Aug, 2018
The first silicon of 64L 3D NAND came out.
Aug, 2018
YMTC introduced Xtacking® architecture and awarded "Best of Show" at 2018 Flash Memory Summit.
Q3, 2018

32L 3D NAND flash memory was put into mass production.

Q3, 2019

64L 3D NAND flash memory was put into mass production.